Custom fabrication and supply chain management
IntelliSense has formed strong affiliations with established MEMS foundries and research institutions throughout the United States and the world. Our partnerships through out the value chain allow IntelliSense to prototype and transfer MEMS based components into production at the lowest cost.
Prototype to manufacturing
It is important for custom MEMS design that design and process development engineers work closely together. That is why IntelliSense has formed strategic partnerships with the leading MEMS foundries. Prototype development, including packaging and test, is done with these partners. Pilot-line manufacturing can be completed with these local foundries as well. To reduce cost, higher volume manufacturing can be done in our overseas manufacturing partnersí» facilities.
The cost of packaging can range from 30 to 95 percent of the final cost of a device. We can help you drive down MEMS, BioMEMS and MOEMS packaging costs, reduce your risk in the development cycle, and smooth the path through pilot scale to high-volume manufacturing. This is done through packaging simulation using are own CAD software IntelliSuite (Packaging Analysis Module, MEMaterial, IntelliFab). Various analyses (thermal, stress/strain, deformation, high frequency, vibrational, etc.) performed can reduce the number of prototyping cycles usually required. Plus, our foundry partnerí»s extensive electronic and optoelectronic packaging assembly capabilities provide the proper working environment and critical interfaces between a device and the macroscopic world.
Our strategic parnetships gives you access to the right vendor for the right job. By working with several vendors, we closely keep track of their evolving expertise and competence in different areas. This allows us to put together the right partnerships to get your devices to market quicker.
Bulk micromachining Surface micromachining SOI-MEMS Electroplated MEMS CMOS-MEMS integration
IntelliSense Fabrication Platform IntelliSense Test Platform IntelliSense Wet Etching Platform IntelliSense DRIE Calibration Tool
Packaging capability Micro-assembly Wafer scale packaging Substrate singulation High volume pick and place Fiber attach and pigtailing Interconnect and flip chip Active optical benches Package sealing Custom packaging
Foundry services brochure Packaging services brochure
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