RELEASE NOTE
Lynnfield, MA ¨C February 1, 2019 ¨C IntelliSense has announced the latest major release of its industry-leading software tools for the MEMS community, IntelliSuite v9.0. The new software version includes major updates for the end-to-end design and simulation package. The new IntelliSense v9.0 features state-of-art implementations in its process simulation and multi-physics simulation capabilities to address leading challenges faced by Industries and researchers in MEMS development, while refining and optimizing the already existing algorithms to work more efficiently. The simulation driven MEMS product development is cutting the time and cost involved in product development for many industries by highlighting any process related bottlenecks in their design or process recipes at the early stages of design and process development.
Some of the new features in IntelliSuite v9.0include:
Cross Talked DRIE Deposition and Taper Shape Control
The taper control feature in the DRIE simulator gives the customers an advantage of controlling the process tapering precisely using the six taper parameters incorporated in the model. Along with the ARDE, Lag effect and undercut control calibration, the taper control calibration gives more accuracy to your simulations.
Corner Compensation and Complex Material Etching
The IntelliSuite process simulation engine, "FabSim", is capable of predicting accurate shapes of etch front during convex corner undercutting of various crystals/substrates based on the etching plane and etchant used. This is achieved by calibrating the etch rate distribution of various processes and updating the material and etchant database in order to render accurate simulations. The material database houses a large number of commonly used crystals/substrates and etchants along with their etch rate distribution databases.
Complex undercutting studies on Si using different Etchants
Quartz Wet Etch Calibration and Simulated Results
Sapphire Wet Etch Calibration and benchmark of simulated results with experiment.
Nonlinear MEMS Simulation
ThermoElectroMechanical (TEM) has updated and revised its nonlinear solver algorithm for faster and more accurate FEA.
Explore and increase your device working bandwidth by studyig the Harmonic and Modal charateristics.
Advanced Mesh Engine to capture Process Imperfections
IntelliSuite houses advanced meshing engine algorithm to generate accurate hex mesh to capture complex boundaries of the CAD geometry. The hex engine coupled with the process simulator enables the user to accurately capture imperfections and boundaries in the simulated geometry and export to the FEM Solver to accurately capture the effects of process imperfections in the device characterstics and performance.
Robust Hex Mesh generation enables user to capture the geometry accurately
Total MEMS Solutions™
IntelliSuite is the industry-leading tool set for MEMS layout design, advanced process simulation, FEA, parametric analysis, system simulation, packaging analysis and more. Covering all aspects of the MEMS design cycle, IntelliSuite v9.0 provides a groundbreaking, end-to-end software solution for MEMS professionals. IntelliSense also provides a global One Stop MEMS Solution with its custom design, consulting and fabrication services. With users in over 30 countries, IntelliSense is the largest MEMS software vendor with its own in-house fabrication facility.
For more information about IntelliSuite v9.0, please contact IntelliSense us at sales@intellisense.com.