IntelliSense ignited the MEMS industry in the early 1990’s with its IntelliSuite® family of innovative CAD tools. IntelliSuite is the industry-leading tool set for MEMS layout design, advanced process simulation, FEA, parametric analysis, system simulation, packaging analysis and more. Covering all aspects of the MEMS design cycle, IntelliSuite provides a groundbreaking, end-to-end software solution for MEMS professionals. IntelliSense also provides a global One-Stop MEMS Solution for universities, blue-chip companies and start-ups with its custom design, consulting and fabrication services. With users in over 30 countries, IntelliSense is the largest MEMS software vendor with its own in-house fabrication facility.
IntelliSense was originally founded in 1991 with the mission of developing MEMS-specific CAD tools. In 1993, we released the first MEMS software tool and, in 1995, we introduced the first completely integrated MEMS CAD tool and opened one of the first MEMS-specific foundries. In 2000, Corning acquired IntelliSense Software at a valuation of $750M and changed its name to Corning IntelliSense. In 2003, the core assets of Corning IntelliSense were re-acquired by the original employees of IntelliSense and, today, IntelliSense operates as an independent, privately owned enterprise.
IntelliSense is a privately owned company headquartered outside of Boston, Massachusetts, USA. For additional corporate or product information, please contact us at
IntelliSense Corp, 220 Broadway, Suite 102, Lynnfield, MA 01940, USA. Directions to IntelliSense
+1 781 933-8098
Sales Info: sales@intellisense.com Customer Support: support@intellisense.com General Info: info@intellisense.com
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Company Name: IntelliSense Software # 187, 3rd floor, 37th Cross, 18th Main, 4th Block Jayanagar, Bangalore, Karnataka, India - 560041 +91 98866 35654, india@intellisense.com
IntelliSense - Total MEMS Solutions Company Name: Advanced Technologies Co.,Ltd. 3rd Floor GotandaMasujima Building, 8-13, HigashiGotanda 1-chome, Shinagawa-ku, TOKYO, Japan 141-0022 +81-3-5475-1540 http://www.ad-tech.co.jp/ Company Name: Intelligent Circuit Engineering Sdn. Bhd. 14387, Taman Paik Siong, Batu 7 ½ , Jalan Puchong, 47180 Puchong, Selangor Darul Ehsan, Malaysia +603 8074 9100 sales@icesb.com www.icesb.com Company Name: Avant Technology Inc 16F-7, No. 27, Guanxin Rd., Hsinchu 30072, Taiwan +886-3-668-6603 Sales: sales@avant-tek.com Support: support@avant-tek.com www.avant-tek.com Company Name: Actron Corp 4th Fl. Sapjoon BD. #13 Woomyeon-dong Seocho-Goo, Seoul Korea 137-900 +82-2-2057-2877 (#1000), +82-10-9168-0277 Sales: sales@avant-tek.com Support: support@avant-tek.com www.actrontc.co.kr Company Name: IntelliSense Corp IntelliSense Corp, 220 Broadway, Suite 102, Lynnfield, MA 01940, USA +1 781 933-8098 Sales Info: sales@intellisense.com Customer Support: support@intellisense.com General Info: info@intellisense.com www.intellisense.com Company Name: Ingenieurbüro Kai Dehrmann Hauptstrasse 143,D-76744 Wörth/Schaidt,Germany +49-6340-919134, Mobile: +49-151-51913124 www.dehrmann.de/kai Company Name: WaldyTech Ltd Maskit 27,P.O.Box 12011,Herzliya Pituach 46733; Israel Phone: +972 9 9573649, Mobile: +972 52 2303608, Fax Email: +972 3 7622799 walter_d@waldytech.com www.waldytech.comuture engineers need to know MEMS to work in today’s major industries. Through the University Partnership Program, universities use IntelliSuite™ to teach basic MEMS concepts—such as process flow, thin-film engineering, wet and dry anisotropic etching, the coupling of multiple physical domains and system modeling of MEMS. IntelliSuite™ allows students to simulate and virtually prototype their devices prior to entering a fab, teaching students MEMS processing as they view their device at each fabrication step.
Following five years of sucessful intergration of IntelliSuite™ at the academic level, the program was formalized in 1999. Since then, universities in over 20 countries have selected IntelliSuite™ as their research and classroom simulation tool.
Membership in our University Partner Program gives academic research groups all the benefits our commercial customers receive, at substantial savings.
2D Asymmetric Silicon Micro-Mirrors Fabricated by Anodic Bonding of an Ultra-thin Silicon Film on a Glass Substrate by Laser Micro-Processing
2D Asymmetric Silicon Micro-Mirrors for Electrostatic Field Distribution Measurement Using Optical Level Method
2D Asymmetric Silicon Micro-Mirrors for Ranging Measurements
Corner compensation mask design on (MEMS) accelerometer structure
Design and Analysis of High Performance MEMS Capacitive Pressure Sensor for TPMS
Design and Modeling of Electrostatically Actuated Microgripper
Design and simulation of pyroelectric detectors with nanometer size spider-web for low thermal conductance
Design of a Triangular Platform Piezoresistive Affinity Microcantilever Sensor for Biochemical Sensing Applications
Design of MEMS Pressure Sensor for Environmental Applications
Design of Metal MUMPs based LLC Resonant Converter for On-chip Power Supplies
Effect of Doping Concentration on the Performance of a Thermally Actuated MEMS Resonator using Piezoresistive Readout
Electrostatic Field Distribution Measurement Using MEMS Micro-mirror Array
Finite element method simulation of three-terminal graphene NEMS switches
Finite element method simulation of three-terminal graphene NEMS switches (POSTER)
MEMS Pressure Sensors for Aerospace Applications
Microfluidic Injector Models Based on Neural Networks
Modeling and Simulation of MEMS Energy Harvester
Modelling and Simulation of Diaphragm Based MEMS Acoustic Sensors
Nanomachined Pyroelectric Detector with Low Thermal Conductance
Pull-In Voltage Calculation of Various Shaped Micro-Cantilevers
Realizing Area Efficient Silicon Micro Structures Using Only Front End Bulk Micromachining
Simulation of an RF MEMS Double-Pole Double-Throw Switch Using Novel Seesaw Design
Simulation of RF-MEMS Bio Implantable Sensor for Orthopedic Application
Virtual prototyping of a MEMS capacitive pressure sensor for TPMS using IntelliSuite
A CAD Architecture for Microelectromechanical Systems
A Generalized Computational Formulation and Model for Transport and Stoichimoetry
A Novel Microelectrochemical Gas Sensor
Accurate Fully-Coupled Natural Frequency Shift of MEMS Actuators due to voltage bias and other external forces
An Improved Meshing Technique and its Application in the Analysis of Large and Complex MEMS Systems
Application of Mechanical-Technology CAD to Microelectronic Device Design and Manufacturing
A Relaxation/Multipole-Accelerated Scheme for Self-Consistent Electromechanical Analysis of Complex 3-D Microelectromechanical Structures
Arnoldy based passive model order reduction algorithm
Automatic Generation of a 3-D Solid Model of a Microfabricated Structure
CAD Modeling of Scratch-Drive Actuation
Calibrated Measurements of Elastic Limit Modulus and the Residual Stress
Coupled Electromechanical and Full wave Electromagnetic Analysis of Micromachined Electromechanically Tunable Capacitors
Design of a Novel Bulk Micro-machined RF MEMS Switch
Design to Succeed Integrated MEMS Development
Effect of squeezed film damping on dynamic finite element analysis of MEMS
Efficient process development for bulk silicon etching using cellular automata simulation techniques
Experimental Investigation, Modeling, and Simulations for MEMS Based Gas Sensor Used for Monitoring Process Chambers in Semiconductor Manufacturing
Fully Coupled Computational Modeling of Transport Phenomena in Microfluidics Applications
General Contact and Hysteresis Analysis of Multi-Dielectric MEMS Devices Under Thermal and Electrostatic Actuation
General MEMS Process Physics Simulation and its Applications
Incorporating CAD for MEMS tools into the Academic Environment
Integrated MEMS Development
IntelliCAD'98 optimizes MEMS design
Large Scale Application Opportunities and Cost Reduction Issues in MEMS
MEMS Computer-aided Design
MEMS Process Simulation and Device Analysis
Manufacturing Issues in High Precision Microfabricated Sensors
Microelectromechanical systems based advanced high performance radio frequency systems
Microfluidic MEMS enabling novel biomedical applications
Numerical Simulation of Micro-Assembly Techniques in MEMS Devices
Numerical Simulation of Micro-Assembly of MEMS Devices and post assembly electromechanical actuation
Optical fiber interferometer for measuring the in-situ deflection characteristics of microelectromechanical structures
Opto-Mechanical Modeling for Fabrication of MEMS Micromirrors
Reducing MEMS Product Development and Commercialization Time
Simulation of Microloading and ARDE in DRIE
Simulations based design of an electrostatically actuated microrelay
Stability Criterion for Micro-scale Concentric Flow of Two Immiscible Liquids
Unified Computational Models for Microfluidics-Specific Applications
Verification of FEM Analysis of Load-Deflection Methods for Measuring Mechanical Properties of Thin-Films
Viscoelasticity and Creep Recovery of Polyimide Thin Films
LOCATION
220 Broadway, Suite 102, Lynnfield, MA 01940, USA
sales@intellisense.com +1781.933.8098fff
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